Invesitgasi Interaksi Fluida Cair dengan Struktur pada Proses Transfer Molding

Abstract

Optimized design of the Plastic Ball Brid Array (PBGA) package gives better PBGA encapsulation processand minimizes the stress concentration and wire deformation of the PBGA structures throught simulations and eksperiments. Thephysical and process parameters (i.e., pressure inlet, diameter of wire, outlet vent size, and mould filled time) were optimized viaresponse surface methodology (RSM) using central composite design (CCD) to minimize the stressconcentration of wire, wire sweep, filling time and void in package during the PBGA encapsulation process. The optimization of the moulded PBGA encapsulation is carried out byconsidering the fluid/structure interaction (FSI) aspects. The optimum empirical modelswere tested and well confirmed with the simulation results. The optimum design of the PBGA package (30 mm × 30 mm) with perimeter outlet vent arrangement for both physicaland process parameters was characterized.The solution for the optimized factors in order to minimize the responses as suggested by Design Expert software was examined through the FSI simulation at inlet Pressure (A) = 5.57 MPa, diameter of wire (B) = 0.05 mm and vent height (C) = 0.36 mm.