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Issue DateTitleAuthor(s)???itemlist.dc.contributor.advisor???
2016Optimization of PBGA Encapsulation Considering Fluid/Structure Interaction Using Response Surface MethodologyRamdan, Dadan; Darianto; Khor, Chu Yee-
20-Mar-2016Fluid Structre Interaction Numerical Simulation of Wiresweep in Electronics PackagingRamdan, Dadan; Harahap, Usman; Rubiantara, Andi; Khor, Chu Yee-
2017Influence of Number Of Mold Cavity Vents on Wire Sweep in PBGA Encapsulation: FSI-MpCCI SimulationRamdan, Dadan; Darianto; Khor, Chu Yee; Abdillah, Mohd. Zulkifli-