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| Issue Date | Title | Author(s) | ???itemlist.dc.contributor.advisor??? |
|---|---|---|---|
| 20-Mar-2016 | Fluid Structre Interaction Numerical Simulation of Wiresweep in Electronics Packaging | Ramdan, Dadan; Harahap, Usman; Rubiantara, Andi; Khor, Chu Yee | - |
| 2017 | Influence of Number Of Mold Cavity Vents on Wire Sweep in PBGA Encapsulation: FSI-MpCCI Simulation | Ramdan, Dadan; Darianto; Khor, Chu Yee; Abdillah, Mohd. Zulkifli | - |
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